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Facility

E•••••• T••••••••• A••••••••• I•• term loan

lien unstatedheld todaySemiconductors and Semiconductor Equipmentsponsor C•••••••• P••••••• carried
Principal held
at least $11.8M
sum of BDC pieces, a lower bound
Fair value
$9.3M
79c on cost
Unfunded
n/a
pieces' unfunded commitments
Pricing
S+625 bp
modal across pieces
PIK
5.25%
paid in kind, the highest piece
Maturity
Dec 31, 2029
html_schedule
Lenders
2 holding
0 exited · 0 named on a deal
On the tape
16 quarters
Sep 30, 2022 to Jun 30, 2026
Lender group
every BDC that holds or held a piece; each row is that lender's own figures
LenderStatusPrincipalFair valueSpreadHeld
M••• S••••• C•••••• C•••
M••• S••••• C•••••• C•••
held$9.5M$7.5M
79c
625 bpSep 30, 2022 to Jun 30, 2026
M•• I••••• F•••• I•••
M•• A•••••• I• L••
held$2.3M$1.8M
79c
625 bpDec 31, 2022 to Jun 30, 2026
Facility through time
pieces summed per quarter end across the BDCs holding it
Quarter endBDCsPrincipal heldOn costSpreadPIKMaturity
Jun 30, 20262$11.8M79c625 bp5.25%Dec 31, 2029
Mar 31, 20262$11.6M62c625 bpDec 29, 2027
Dec 31, 20252$11.6M64c625 bpDec 29, 2027
Sep 30, 20252$11.7M71c625 bpDec 29, 2027
Jun 30, 20252$11.8M71c625 bpDec 29, 2027
Mar 31, 20252$11.8M76c625 bpDec 29, 2027
Dec 31, 20242$23.8M81c625 bpDec 29, 2027
Sep 30, 20242$12.1M83c625 bpDec 29, 2027
Jun 30, 20242$12.1M92c625 bpDec 29, 2027
Mar 31, 20242$12.2M94c625 bpDec 29, 2027
Dec 31, 20232$11.4M92c625 bpDec 29, 2027
Sep 30, 20232$11.4M97c625 bpDec 29, 2027
Jun 30, 20232$11.6M98c625 bpFeb 10, 2028
Mar 31, 20232$11.6M97c625 bpFeb 10, 2028
Dec 31, 20222$11.7M97c625 bpFeb 10, 2028
Sep 30, 20221$9.3M98c625 bpFeb 10, 2028
What changed on this facility
position and facility grain, including routine
  • Mark recovered Jun 30, 2026
    ••• Locked
  • Maturity extended (observed) Jun 30, 2026
    ••• Locked
  • PIK interest appears Jun 30, 2026
    ••• Locked
  • Marked down across lenders Sep 30, 2024
    ••• Locked
  • Marked down across lenders Dec 31, 2023
    ••• Locked
  • New lender joined a facility Dec 31, 2022
    ••• Locked
Other pieces of this borrower's structure
How this facility is known
Grain
E•••••• T••••••••• A••••••••• I•• x term loanderivedborrower group x kind x lien; tranches with different maturities sit under it
Size
lower bound: sum of BDC piecesderived
Sponsor basis
the sponsor's own portfolio page lists a company of this namederived
Status
performingsignalnon-accrual, default and restructuring are not on this tape and are never inferred from a mark
Origin
bdc tapereported